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STE2004 数据表(PDF) 65 Page - STMicroelectronics |
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STE2004 数据表(HTML) 65 Page - STMicroelectronics |
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65 / 66 page ![]() 65/66 STE2004 Figure 76. Alignment marks dimensions Table 30. Bumps Table 31. Die Mechanical Dimensions 94 µm 39 µm Bump Number Dimensions Bumps Size 30 µm X 98 µm X 17.5 Pad Size 43 µm X 107µm Pad Pitch 50 µm Spacing between Bumps 20 µm Die Size (X x Y) 6.42mm x 1.46mm Wafers Thickness 500 µm Table 32. Revision History Date Revision Description of Changes May 2004 3 Moved the value of FSCLK parameter from Min. to Max. on the page 60/ 66. July 2004 4 Inserted Table 24 -N-Line Inversion in the page 44/66 |
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