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STM32U535NET6QTR 数据表(PDF) 263 Page - STMicroelectronics |
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STM32U535NET6QTR 数据表(HTML) 263 Page - STMicroelectronics |
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263 / 278 page  DS14217 Rev 1 263/278 STM32U535xx Package information 274 Figure 67. UFBGA64 – Recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 135. UFBGA64 – Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 Table 136. UFBGA64 - Recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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