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MPC604EC/D 数据表(PDF) 2 Page - NXP Semiconductors

部件名 MPC604EC/D
功能描述  PowerPC 604™ RISC Microprocessor Hardware Specifications
PDF  32 Pages
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制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

MPC604EC/D 数据表(HTML) 2 Page - NXP Semiconductors

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2
604 Hardware Specifications
Preliminary/Subject to Change without Notice
1.1 General Parameters
Technology
0.5
µm CMOS, four-layer metal
Chip size
196 mm2, 12.4 mm x 15.8 mm
Packages
Surface-mount 304-pin C4-CQFP
Surface-mount 255-lead ceramic ball grid array (BGA)
Voltage
3.3 V
± 5%
Maximum power dissipation 24 W @ 133 MHz
19 W @ 100 MHz
1.2 Electrical and Thermal Characteristics
This section provides both the AC and DC electrical specifications and thermal characteristics for the 604.
The following specifications are preliminary and subject to change without notice. For the most recent
specifications, contact your local Motorola or IBM sales office.
1.2.1 DC Electrical Characteristics
Table 1 and Table 2 provide the absolute maximum rating and thermal characteristics for the 604.
Table 1. PowerPC 604 Microprocessor Absolute Maximum Ratings
Characteristic
Symbol
Value
Unit
Supply voltage
Vdd
–0.3 to 3.6
V
Input voltage
Vin
–0.3 to 5.5
V
Storage temperature range
Tstg
–55 to 150
°C
Notes:
1. Functional operating conditions are given in DC electrical specifications. Absolute
maximum ratings are stress ratings only, and functional operation at the maximums is
not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2. Caution: Input voltage must not be greater than the supply voltage by more than 2.5 V
during power-on reset.
Table 2. PowerPC 604 Microprocessor Thermal Characteristics
Characteristic
Symbol
Value
Rating
C4-CQFP package thermal resistance, junction-to-case
θJC
0.03
°C/W
BGA package thermal resistance, junction-to-case
θJC
0.03
°C/W
Notes:
1. For the BGA package, the
θJC measurement is made from die junction to the back of the
bare silicon die.
2. The junction temperature of the chip is a function of several parameters including
θJC.
Please refer to Section 1.8, “Thermal Management Information,” for additional details.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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