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MPC604EC/D 数据表(PDF) 2 Page - NXP Semiconductors |
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MPC604EC/D 数据表(HTML) 2 Page - NXP Semiconductors |
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2 / 32 page ![]() 2 604 Hardware Specifications Preliminary/Subject to Change without Notice 1.1 General Parameters Technology 0.5 µm CMOS, four-layer metal Chip size 196 mm2, 12.4 mm x 15.8 mm Packages Surface-mount 304-pin C4-CQFP Surface-mount 255-lead ceramic ball grid array (BGA) Voltage 3.3 V ± 5% Maximum power dissipation 24 W @ 133 MHz 19 W @ 100 MHz 1.2 Electrical and Thermal Characteristics This section provides both the AC and DC electrical specifications and thermal characteristics for the 604. The following specifications are preliminary and subject to change without notice. For the most recent specifications, contact your local Motorola or IBM sales office. 1.2.1 DC Electrical Characteristics Table 1 and Table 2 provide the absolute maximum rating and thermal characteristics for the 604. Table 1. PowerPC 604 Microprocessor Absolute Maximum Ratings Characteristic Symbol Value Unit Supply voltage Vdd –0.3 to 3.6 V Input voltage Vin –0.3 to 5.5 V Storage temperature range Tstg –55 to 150 °C Notes: 1. Functional operating conditions are given in DC electrical specifications. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device. 2. Caution: Input voltage must not be greater than the supply voltage by more than 2.5 V during power-on reset. Table 2. PowerPC 604 Microprocessor Thermal Characteristics Characteristic Symbol Value Rating C4-CQFP package thermal resistance, junction-to-case θJC 0.03 °C/W BGA package thermal resistance, junction-to-case θJC 0.03 °C/W Notes: 1. For the BGA package, the θJC measurement is made from die junction to the back of the bare silicon die. 2. The junction temperature of the chip is a function of several parameters including θJC. Please refer to Section 1.8, “Thermal Management Information,” for additional details. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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