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MPC604EC/D 数据表(PDF) 20 Page - NXP Semiconductors

部件名 MPC604EC/D
功能描述  PowerPC 604™ RISC Microprocessor Hardware Specifications
PDF  32 Pages
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制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

MPC604EC/D 数据表(HTML) 20 Page - NXP Semiconductors

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20
604 Hardware Specifications
Preliminary/Subject to Change without Notice
1.6.1.3 Mechanical Dimensions of the Motorola C4-CQFP Package
Figure 11 shows the mechanical dimensions of the Motorola C4-CQFP package.
Figure 11. Mechanical Dimensions of the Motorola C4-CQFP Package
(W)
VIEW Y
3 PLACES
C2
VIEW AB
AC
X = L, M, N
VIEW Y
3X
C1
304
VIEW AB
C
U
F
A
B
S1
S
V
V1
176
77
153
152
229
228
0.20 (0.008) T L–M N
4X 76 TIPS
SEATING
PLANE
AC
G
P
(K)
E
1
(R1)
R
(R2)
R
(Z)
DATUM PLANE
0.25 (0.010)
J
SECTION AC–AC
D
ROTATED 90
° CW
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
39.55
39.75
1.557
1.564
B
39.55
39.75
1.557
1.564
C
2.50
3.25
0.098
0.128
C1
0.50
—
0.020
—
C2
2.00
2.40
0.079
0.094
C3
0.60
1.00
0.024
0.039
E
0.50
0.70
0.020
0.028
F
5.00
16.00
0.197
0.630
G
0.50 BASIC
0.020 BASIC
J
0.12
0.17
0.005
0.007
K
0.50 REF
0.020 REF
P
0.25 BASIC
0.010 BASIC
R1
0.10
0.20
0.004
0.008
R2
0.15 REF
0.006 REF
S
42.60 BASIC
1.677 BASIC
S1
21.30 BASIC
0.839 BASIC
U
5.00
16.00
0.197
0.630
V
42.60 BASIC
1.677 BASIC
V1
21.30 BASIC
0.839 BASIC
W
0.63 REF
0.025 REF
Z
1.48 REF
0.058 REF
1
°
7
°
1
°
7
°
1
2
°
6
°
2
°
6
°
–X–
–L–
–N–
–M–
–H–
–T–
–H–
θ
θ
θ
θ
S
L
0.20 (0.008)
–M S
HN S
S
L
M
0.20 (0.008)
–M S
HN S
S
L
0.08 (0.003)
–M S
T
C6
C3
C6
—
0.50
—
0.020
D
0.18
0.30
0.007
0.012
NOTES:
1. DIMENSIONS AND TOLERENCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE
IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT WITH
THE LEAD WHERE THE LEAD EXITS THE
CERAMIC.
4. DATUMS
,
AND
TO BE
DETERMINED AT DATUM PLANE
.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE
.
M
M
–H–
–L–
–M–
–N–
–H–
–T–
0.10 (0.004)
T
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
AR
CH
IVE
D B
Y F
RE
ES
CA
LE
SE
MI
CO
ND
UC
TO
R,
INC
.



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