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MPC604EC/D 数据表(PDF) 21 Page - NXP Semiconductors |
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MPC604EC/D 数据表(HTML) 21 Page - NXP Semiconductors |
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21 / 32 page ![]() 604 Hardware Specifications 21 Preliminary/Subject to Change without Notice 1.6.1.4 Mechanical Dimensions of the IBM C4-CQFP Package Figure 12 shows the mechanical dimensions for the IBM C4-CQFP package. Figure 12. Mechanical Dimensions of the IBM C4-CQFP Package S A T L – M S N S 228 229 153 152 77 76 1 304 V B 0.13 (0.005) T L – M N 0.20 (0.008) T L – M N 76 TIPS, 4 PLACES S S S S – L – – N – – M – VIEW Y (see Figure 13) 0.08 (0.003) VIEW P (see Figure 14) – T – W C SEATING PLANE 0.13 (0.005) M M Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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