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MPC604EC/D 数据表(PDF) 13 Page - NXP Semiconductors |
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MPC604EC/D 数据表(HTML) 13 Page - NXP Semiconductors |
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13 / 32 page ![]() 604 Hardware Specifications 13 Preliminary/Subject to Change without Notice 1.4.2 Pinout Diagram for the BGA Package Figure 10 (in part A) shows the pinout of the BGA package as viewed from the top surface. Part B shows the side profile of the BGA package to indicate the direction of the top surface view. Figure 10. Pinout of the BGA Package as Viewed from the Top Surface A B C D E F G H J K L M N P R T 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 Not to Scale Substrate Asm. Encapsulation View Part B Die Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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