24

604 Hardware Specifications

Preliminary/Subject to Change without Notice

1.6.2.2 Mechanical Dimensions of the BGA Package

Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the IBM and Motorola

BGA package.

Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature of the BGA Package

P

N

2X

A1

12 34 56 78 9 10 11 12 13 14 15 16

T

R

P

N

M

L

K

J

H

G

F

E

D

C

B

A

255X

D

H

C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

DIM

A

MIN

MAX

MIN

MAX

INCHES

21.000 BSC

0.827 BSC

MILLIMETERS

B

21.000 BSC

0.827 BSC

C

2.300

3.160

0.091

0.124

D

0.820

0.930

0.032

0.036

G

1.270 BSC

0.050 BSC

H

0.790

0.990

0.031

0.039

K

0.635 BSC

0.025 BSC

N

5.000 16.000

0.197

0.630

P

5.000 16.000

0.197

0.630

CORNER

2X

A

0.200

B

–F–

0.200

–E–

0.150 T

–T–

K

G

K

S

E

S

0.300

F S

T

S

0.150

T

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

AR

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CA

LE

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MI

CO

ND

UC

TO

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INC

.