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ADN2806 数据表(PDF) 18 Page - Analog Devices |
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ADN2806 数据表(HTML) 18 Page - Analog Devices |
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18 / 20 page ![]() ADN2806 Rev. 0 | Page 18 of 20 Transmission Lines Minimizing reflections in the ADN2806 requires use of 50 Ω transmission lines for all pins with high frequency input and output signals, including PIN, NIN, CLKOUTP, CLKOUTN, DATAOUTP, and DATAOUTN (also REFCLKP and REFCLKN, if a high frequency reference clock is used, such as 155 MHz). It is also necessary for the PIN/NIN input traces to be matched in length and for the CLKOUTP/CLKOUTN and DATAOUTP/DATAOUTN output traces to be matched in length to avoid skew between the differential traces. The high speed inputs, PIN and NIN, are internally terminated with 50 Ω to an internal reference voltage (see Figure 20). A 0.1 μF is recommended between VREF, Pin 3, and GND to provide an ac ground for the inputs. As with any high speed, mixed-signal design, take care to keep all high speed digital traces away from sensitive analog nodes. CIN CIN 0.1µF NIN PIN ADN2806 2.5V VREF LIM 50Ω 50Ω 50Ω 50Ω 3kΩ Figure 20. ADN2806 AC-Coupled Input Configuration Soldering Guidelines for Lead Frame Chip Scale Package The lands on the 32-lead LFCSP are rectangular. The printed circuit board (PCB) pad for these should be 0.1 mm longer than the package land length and 0.05 mm wider than the package land width. The land should be centered on the pad. This ensures that the solder joint size is maximized. The bottom of the chip scale package has a central exposed pad. The pad on the PCB should be at least as large as this exposed pad. The user must connect the exposed pad to VEE using plugged vias so that solder does not leak through the vias during reflow. This ensures a solid connection from the exposed pad to VEE. Choosing AC Coupling Capacitors AC coupling capacitors at the input (PIN, NIN) and output (DATAOUTP, DATAOUTN) of the ADN2806 can be optimized for the application. When choosing the capacitors, the time constant formed with the two 50 Ω resistors in the signal path must be considered. When a large number of consecutive identical digits (CIDs) are applied, the capacitor voltage can droop due to baseline wander (see Figure 21), causing pattern- dependent jitter (PDJ). The user must determine how much droop is tolerable and choose an ac coupling capacitor based on that amount of droop. The amount of PDJ can then be approximated based on the capacitor selection. The actual capacitor value selection can require some trade-offs between droop and PDJ. For example, assuming that 2% droop can be tolerated, the maximum differential droop is 4%. Normalizing to V p-p: Droop = ΔV = 0.04 V = 0.5 V p-p (1 − e−t/τ); therefore, τ = 12t where: τ is the RC time constant (C is the ac coupling capacitor, R = 100 Ω seen by C). t is the total discharge time, which is equal to nT, where n is the number of CIDs, and T is the bit period. The capacitor value can then be calculated by combining the equations for τ and t: C = 12 nT/R Once the capacitor value is selected, the PDJ can be approximated as PDJpspp = 0.5 tr(1 − e(−nT/RC))/0.6 where: PDJpspp is the amount of pattern-dependent jitter allowed (<0.01 UI p-p typical). tr is the rise time, which is equal to 0.22/BW, where BW ~ 0.7 (bit rate). Note that this expression for tr is accurate only for the inputs. The output rise time for the ADN2806 is ~100 ps regardless of the data rate. |
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