ADN2806

Rev. 0 | Page 20 of 20

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

1

32

8

9

25

24

16

17

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.45

3.30 SQ

3.15

PIN 1

INDICATOR

0.60 MAX

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

Figure 22. 32-Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADN2806ACPZ1

−40°C to +85°C

32-Lead LFCSP_VQ

CP-32-3

ADN2806ACPZ-500RL71

−40°C to +85°C

32-Lead LFCSP_VQ, Tape-Reel, 500 pieces

CP-32-3

ADN2806ACPZ-RL71

−40°C to +85°C

32-Lead LFCSP_VQ, Tape-Reel, 1500 pieces

CP-32-3

EVAL-ADN2806EB

Evaluation Board

©2006 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D05831–0–2/06(0)