ADP1821ARQZ-R7 datasheet(5/24 Pages) AD

5 / 24 page

ADP1821

Rev. B | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VCC, SHDN, SYNC, FREQ, COMP, SS, FB to

GND, PVCC to PGND, BST to SW

−0.3 V to +6 V

BST to GND

−0.3 V to +30 V

CSL to GND

−1 V to +30 V

DH to GND

(VSW − 0.3 V) to

(VBST + 0.3 V)

DL to PGND

−0.3 V to

(VPVCC + 0.3 V)

SW to GND

−2 V to +30 V

PGND to GND

±2 V

θJA, 2-Layer (SEMI Standard Board)

150°C/W

θJA, 4-Layer (JEDEC Standard Board)

105°C/W

Operating Ambient Temperature Range

−40°C to +85°C

Operating Junction Temperature Range

−55°C to +125°C

Storage Temperature Range

−65°C to +150°C

Maximum Soldering Lead Temperature

260°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other condition s above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages

are referenced to GND.

ESD CAUTION

SIMPLIFIED BLOCK DIAGRAM

THERMAL

SHUTDOWN

LOGIC

UVLO

OSCILLATOR

FAULT

PWM

VCC

FAULT

REFERENCE

THSD

UVLO

0.6V

0.8V

100kΩ

2.5kΩ

BST

PVCC

PGND

CSL

PWGD

COMP

SYNC

FREQ

GND

VCC

ADP1821

SHDN

Figure 3. Simplified Block Diagram

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