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AD8330ACP-R2 数据表(PDF) 28 Page - Analog Devices |
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AD8330ACP-R2 数据表(HTML) 28 Page - Analog Devices |
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28 / 32 page ![]() AD8330 Rev. C | Page 28 of 32 OUTLINE DIMENSIONS *COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2 EXCEPT FOR EXPOSED PAD DIMENSION. 1 0.50 BSC 0.60 MAX PIN 1 INDICATOR 1.50 REF 0.50 0.40 0.30 0.25 MIN 0.45 2.75 BSC SQ TOP VIEW 12° MAX 0.80 MAX 0.65 TYP SEATING PLANE PIN 1 INDICATOR 0.90 0.85 0.80 0.30 0.23 0.18 0.05 MAX 0.02 NOM 0.20 REF 3.00 BSC SQ *1.65 1.50 SQ 1.35 16 5 13 8 9 12 4 EXPOSED PAD BOTTOM VIEW THE EXPOSED PAD IS NOT CONNECTED INTERNALLY. FOR INCREASED RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED THAT THE PADDLE BE SOLDERED TO THE GROUND PLANE. Figure 69. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 3 mm × 3 mm Body, Very Thin Quad (CP-16-3) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-137-AB 16 9 8 1 PIN 1 SEATING PLANE 0.010 0.004 0.012 0.008 0.025 BSC 0.010 0.006 0.050 0.016 8° 0° COPLANARITY 0.004 0.065 0.049 0.069 0.053 0.197 0.193 0.189 0.158 0.154 0.150 0.244 0.236 0.228 Figure 70. 16-Lead Shrink Small Outline Package [QSOP] (RQ-16) Dimensions shown in inches |
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