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AM29BDS643G 数据表(PDF) 48 Page - Advanced Micro Devices

部件名 AM29BDS643G
功能描述  64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory
PDF  49 Pages
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制造商  AMD [Advanced Micro Devices]
网页  http://www.amd.com
标志 AMD - Advanced Micro Devices

AM29BDS643G 数据表(HTML) 48 Page - Advanced Micro Devices

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46
Am29BDS643G
25692A2 May 8, 2006
D A TA
SH EE T
PHYSICAL DIMENSIONS*
VDA044—44-Ball Very Thin Fine-Pitch Ball Grid Array (FBGA) 9.2 x 8.0 mm Package
* For reference only. BSC is an ANSI standard for Basic Space Centering.
A
M
M
C
C
φ0.05
φ0.15
B
1.00
SD
1.00
A1 CORNER
7
7
6
φb
E1
D1
SE
e
BOTTOM VIEW
NF2
10 9
A
C
D
B
87 6 5 4 3 2 1
NF3
NF4
NF1
TOP VIEW
0.50 REF
0.50 REF
-0.50
1.00
+0.20
D
A
E
A1 ID
B
SIDE VIEW
A
SEATING PLANE
C
0.10
A2
A1
C
C
0.08
NF1-4
N/A
9.20 mm x 8.00 mm
PACKAGE
VDA 044
NOM.
-
-
-
1.00
-
0.78
MAX.
9.20 BSC.
8.00 BSC.
10
-
MIN.
0.64
0.20
4.50 BSC.
1.50 BSC.
4
44
0.30
0.35
0.25 BSC.
A
0.25
0.50 BSC.
ME
D
E
JEDEC
PACKAGE
SYMBOL
A
A2
A1
MD
D1
E1
φb
N
NOTE
PACKAGE OUTLINE TYPE
DEPOPULATED SOLDER BALLS
ROW MATRIX SIZE E DIRECTION
BALL FOOTPRINT
BALL PITCH
BODY SIZE
BALL HEIGHT
BODY SIZE
BODY THICKNESS
OVERALL THICKNESS
BALL DIAMETER
ROW MATRIX SIZE D DIRECTION
TOTAL BALL COUNT
BALL FOOTPRINT
SOLDER BALL PLACEMENT
e
SD/SE
NOTES UNLESS OTHERWISE SPECIFIED:
1.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE
IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF SOLDER
BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM Z .
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.



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