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Am29SL400C

Am29SL400C_00_A6 January 23, 2007

D A TA

SH EE T

REVISION SUMMARY

Revision A (August 14, 2002)

Initial Release.

Revision A+1 (August 28, 2002)

Sector Protection/Unprotection

Changed beginning of second paragraph from, “The primary

method....” to read, “Sector protection/unprotection.”

Deleted third paragraph.

FBB048—48-Ball Fine-Pitch Ball Grid Array (FBGA)

6 x 8 mm package

Changed number in row D in table from 9.00 mm to 8.0 mm.

Revision A+2 (February 5, 2003)

Global

Changed fastest speed option from 103 ns to 100 ns, regu-

lated voltage, added 110 ns speed option standard voltage.

General Description

Changed first sentenced to indicate 48-pin TSOP package

option.

Command Definitions, Table 5

Removed TBD markers from device ID, Top Boot Block to

70h.

Removed TBD markers from device ID, Bottom Boot Block to

FIh.

Changed address bits A18–A11 to A17–A11.

Physical Dimensions, 48-pin TSOP

Changed from Reverse to Standard TSOP package.

Revision A+3 (February 26, 2003)

Global

Added 110 ns speed option.

Distinctive Characteristics

Updated Automatic Sleep Mode and standby mode current

values.

Pin Configuration

Ordering Information

Changed WB package type to WA.

DC Characteristics, CMOS Compatible

Automatic Sleep Mode Typ value.

Revision A+4 (March 18, 2003)

Ordering Information, Valid Combinations

Removed dashes from Order Numbers.

Revision A+5 (March 3, 2005)

Ordering Information

Added Commercial and Industrial Pb-free Package tempera-

tures.

Valid Combinations for TSOP package

Added two package codes.

Valid Combination for FBGA package

Added two package codes.

Global

Added Colophon. Updated Trademark information.

Revision A6 (January 23, 2007)

AC Characteristics

maximum specification.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable

to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those products.

Trademarks

Copyright © 2002–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-

marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are

for identification purposes only and may be trademarks of their respective companies.

Copyright © 2006–2007 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations

thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.