TSL25413 datasheet(32/39 Pages) OSRAM

32 / 39 page

Datasheet, Public

Page 31

[v2-00] 2023-Mar-10

Document Feedback

TSL2541 − Soldering & Storage Information

Storage Information

Moisture Sensitivity Optical characteristics of the device can be

adversely affected during the soldering process by the release

and vaporization of moisture that has been previously

absorbed into the package. To ensure the package contains the

smallest amount of absorbed moisture possible, each device is

baked prior to being dry packed for shipping. Devices are dry

packed in a sealed aluminized envelope called a

moisture-barrier bag with silica gel to protect them from

ambient moisture during shipping, handling, and storage

before use.

Shelf Life

The calculated shelf life of the device in an unopened moisture

barrier bag is 24 months from the date code on the bag when

stored under the following conditions:

• Shelf Life: 24 months

• Ambient Temperature: <40°C

• Relative Humidity: <90%

Rebaking of the devices will be required if the devices exceed

the 24 months shelf life or the Humidity Indicator Card shows

that the devices were exposed to conditions beyond the

allowable moisture region.

Floor Life

The QFN package has been assigned a moisture sensitivity level

of MSL 3. As a result, the floor life of devices removed from the

moisture barrier bag is 168 hours from the time the bag was

opened, provided that the devices are stored under the

following conditions:

• Floor Life: 168 hours

• Ambient Temperature: <30°C

• Relative Humidity: <60%

If the floor life or the temperature/humidity conditions have

been exceeded, the devices must be rebaked prior to solder

reflow or dry packing.

Rebaking Instructions

When the shelf life or floor life limits have been exceeded,

rebake at 50°C for 12 hours.

TSL25413 数据表(PDF) 32 Page - OSRAM GmbH

TSL25413 数据表(HTML) 32 Page - OSRAM GmbH

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39

数据表下载