ams Datasheet

Page 41

[v1-00] 2016-Apr-05

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TSL2580, TSL2581 − Mechanical Data

Figure 44:

Package FN — Dual Flat No-Lead Packaging Configuration

Note(s):

1. All linear dimensions are in micrometers. Dimension tolerance is

±20 μm unless otherwise noted.

2. The photodiode active area is 466

μm square and its center is 140 μm above and 20μm to the right of the package center. The die

placement tolerance is ± 75

μm in any direction.

3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

5. This package contains no lead (Pb).

6. This drawing is subject to change without notice.

PACKAGE FN

Dual Flat No-Lead

203

+ 8

6 SDA

5 INT

4 SCL

Vdd 1

ADDR SEL 2

GND 3

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Lead Free

Pb

300

+ 50

650

2000

+ 75

2000

+ 75

PIN 1

PIN 1

END VIEW

650

+ 50

Seating Plane

PIN OUT

TOP VIEW

Photo-Active Area

750

+ 150

300

+ 50

650

Green

RoHS