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MPC862 数据表(PDF) 85 Page - Freescale Semiconductor, Inc |
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MPC862 数据表(HTML) 85 Page - Freescale Semiconductor, Inc |
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85 / 88 page ![]() MPC862/857T/857DSL PowerQUICC™ Family Hardware Specifications, Rev. 3 Freescale Semiconductor 85 Mechanical Data and Ordering Information Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 SIDE VIEW BOTTOM VIEW 18X 4X 357X b TOP VIEW A2 A3 e 0.3 M C D A A1 D2 0.15 M C E E2 0.2 C A B 0.2 D1 E1 AB 0.25 C 0.35 C C NOTES: 1. Dimensions and tolerancing per ASME Y14.5M, 1994. 2. Dimensions in millimeters. 3. Dimension b is the maximum solder bal l diameter measured parallel to datum C. DIM MIN MAX MILLIMETERS A --- 2.05 0.50 0.70 A2 0.95 1.35 A3 0.70 0.90 b 0.60 0.90 D 25.00 BSC D1 22.86 BSC D2 22.40 22.60 e 1.27 BSC E 25.00 BSC E1 22.86 BSC E2 22.40 22.60 A1 Case No. 1103-01 |
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