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ST25R200 数据表(PDF) 77 Page - STMicroelectronics |
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ST25R200 数据表(HTML) 77 Page - STMicroelectronics |
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77 / 88 page  7 Package information To meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions, and product status are available at www.st.com. ECOPACK is an ST trademark. 7.1 UFQFPN24 package information This UFQFPN is a 24-pin, 4 x 4 mm, 0.5 mm pitch, thermally enhanced ultra-thin fine pitch quad flat no lead package. Figure 23. UFQFPN24 - Outline 1 24 6 12 18 A1 PIN #1 ID B E A BOTTOM VIEW SIDE VIEW TOP VIEW FRONT VIEW C A3 E2 L 3Z_UFQFPN24_ME_V2 18 12 6 1 24 1. Drawing is not to scale. 2. Coplanarity applies to the exposed pad as well as the terminal. ST25R200 Package information DS13658 - Rev 2 page 77/88 |
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