SSM2211

Rev. D | Page 2 of 24

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications....................................................................................... 1

Functional Block Diagram .............................................................. 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Electrical Characteristics ................................................................. 3

Absolute Maximum Ratings............................................................ 5

Thermal Resistance ...................................................................... 5

ESD Caution.................................................................................. 5

Pin Configurations and Function Descriptions ........................... 6

Typical Performance Characteristics ............................................. 7

Product Overview........................................................................... 14

Thermal Performance—LFCSP................................................ 14

Typical Applications ....................................................................... 15

Bridged Output vs. Single-Ended Output Configurations ... 15

Speaker Efficiency and Loudness............................................. 15

Power Dissipation....................................................................... 16

Output Voltage Headroom........................................................ 17

Automatic Shutdown-Sensing Circuit..................................... 17

Shutdown-Circuit Design Example ......................................... 18

Start-Up Popping Noise............................................................. 18

SSM2211 Amplifier Design Example .................................. 18

Single-Ended Applications........................................................ 19

Driving Two Speakers Single Endedly..................................... 19

Evaluation Board ........................................................................ 20

LFCSP Printed Circuit Board Layout Considerations .......... 20

Outline Dimensions ....................................................................... 21

Ordering Guide .......................................................................... 21

REVISION HISTORY

11/06—Rev. C to Rev. D

Updated Format..................................................................Universal

Changes to General Description .................................................... 1

Changes to Electrical Characteristics ............................................ 3

Changes to Absolute Maximum Ratings ....................................... 5

Added Table 6.................................................................................... 6

Changes to Figure 32...................................................................... 11

Changes to the Product Overview Section ................................. 14

Changes to the Output Voltage Headroom Section................... 17

Changes to the Start-Up Popping Noise Section........................ 18

Changes to the Evaluation Board Section ................................... 20

Updated Outline Dimensions ....................................................... 21

Changes to Ordering Guide .......................................................... 21

10/04—Data Sheet Changed from Rev. B to Rev. C

Updated Format..................................................................Universal

Changes to General Description .................................................... 1

Changes to Table 5............................................................................ 4

Deleted Thermal Performance—SOIC Section ........................... 8

Changes to Figure 31...................................................................... 10

Changes to Figure 40...................................................................... 12

Changes to Thermal Performance—LFCSP Section ................. 13

Deleted Figure 52, Renumbered Successive Figures .................. 14

Deleted Printed Circuit Board Layout—SOIC Section ............. 14

Changes to Output Voltage Headroom Section ......................... 16

Changes to Start-Up Popping Noise Section .............................. 17

Changes to Ordering Guide .......................................................... 20

10/02—Data Sheet Changed from Rev. A to Rev. B

Deleted 8-Lead PDIP .........................................................Universal

Updated Outline Dimensions....................................................... 15

5/02—Data Sheet Changed from Rev. 0 to Rev. A

Edits to General Description ...........................................................1

Edits to Package Type .......................................................................3

Edits to Ordering Guide ...................................................................3

Edits to Product Overview ...............................................................8

Edits to Printed Circuit Board Layout Considerations ............. 13

Added section Printed Circuit Board Layout

Considerations—LFCSP................................................................ 14