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TFBGA PACKAGE OUTLINE

Table 2. TFBGA 6x6x1.20 36 F6x6 0.80

(2) TFBGA stands for Thin Profile Fine Pitch Ball Grid Array.

Thin profile: The total profile height (DIm A) is measured from the seating plane to the top of the component.

A = 1.01 to 1.20 mm

Fine pitch < 1.00 mm pitch.

(3) The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink, metallized markings or other

feature of package body or integral heatslug.

A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner.

Exact shape of each corner is optional.

Ref

Min.

Typ.

Max.

A1.01

1.Max mounted height is 1.16 mm. Based on a 0.37 mm ball pad diameter.

Solder paste is 0.15 mm thick with 0.37 mm diameter.

A1

0.21

A2

0.820

b

0.35

0.40

0.45

D

5.85

6.00

6.15

D1

4.00

E

5.85

6.00

6.15

E1

4.00

e

0.72

0.80

0.88

f

0.85

1.00

1.15

ddd

1.00