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ADPA7002AEHZ-R7 数据表(PDF) 1 Page - Analog Devices

部件名 ADPA7002AEHZ-R7
功能描述  GaAs, pHEMT, MMIC,1/2 W, 18 GHz to 44 GHz, Power Amplifier
PDF  20 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADPA7002AEHZ-R7 数据表(HTML) 1 Page - Analog Devices

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Data Sheet
ADPA7002
GaAs, pHEMT, MMIC,1/2 W, 18 GHz to 44 GHz, Power Amplifier
Rev. A
DOCUMENT FEEDBACK
TECHNICAL SUPPORT
Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to
change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
FEATURES
Output P1dB: 28 dBm (typical at 34 GHz to 44 GHz)
PSAT: 29.5 dBm (typical at 24 GHz to 34 GHz)
Gain: 15 dB (typical at 34 GHz to 44 GHz)
IP3: 38 dBm (typical)
Integrated power detector
Supply voltage: 5 V at 700 mA
16-terminal, 6 mm × 6 mm, ceramic, high frequency, air cavity
package
APPLICATIONS
Military
Test instrumentation
Communications
FUNCTIONAL BLOCK DIAGRAM
Figure 1.
GENERAL DESCRIPTION
The ADPA7002 is a gallium arsenide (GaAs), pseudomorphic high
electron mobility transfer (pHEMT), monolithic microwave integrat-
ed circuit (MMIC), 28 dBm (1/2 W) power amplifier, with an integrat-
ed temperature compensated on-chip power detector that operates
between 18 GHz and 44 GHz. The ADPA7002 provides 15 dB of
small signal gain and 30 dBm of saturated output power (PSAT) at
32 GHz from a 5 V supply. With an IP3 of 38 dBm, the ADPA7002 is
ideal for linear applications such as electronic countermeasure and
instrumentation applications demanding >28 dBm of efficient PSAT.
The RF inputs and outputs are internally matched and dc blocked
for ease of integration into higher level assemblies. The ADPA7002
is housed in a 6 mm × 6 mm, ceramic leadless chip with heat sink
(LCC_HS) that exhibits low thermal resistance and is compatible
with surface-mount manufacturing techniques.


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