ADL5961ACCZ-R2 datasheet(7/34 Pages) AD

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Data Sheet

ADL5961

ABSOLUTE MAXIMUM RATINGS

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Table 3. Absolute Maximum Ratings

Parameter

Rating

Supply Voltage (AVCC and OVCC)

5.5 V

RFIN, RFOUT Input AC Power

Average1

30 dBm

Peak1

35 dBm

DC Voltage

OVDD

−0.3 V to +3.8 V

SCK, CS, and SDIO

−0.3 V to OVDD + 0.3 V

IFFP, IFFM, IFRP, IFRM2

−0.3 V to OVCC + 0.3 V

Any Other Pin3

−0.3 V to AVCC + 0.3 V

DC Current RFIN to or from RFOUT

100 mA

Temperature

Maximum TJ

150°C

TA Operating Range

−40°C to +105°C

Storage Range

−65°C to +150°C

1 Not production tested. Guaranteed by design and correlation to production

tested parameters. Peak power duty cycle is 10% maximum.

2 The voltage on these pins must not exceed 5.5 V, OVCC + 0.3 V, or be less

than –0.3 V.

3 The voltage on these pins must not exceed 5.5 V, AVCC + 0.3 V, or be less

than –0.3 V.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and operating

environment. Careful attention to PCB thermal design is required.

Table 4. Thermal Resistance

Package

Type1

θJA2

θJB3

θJCT4

θJCB5

ΨJT6

ΨJB7

Unit

CC-26-2

39.32

13.10

30.09

7.63

1.30

12.95

°C/W

1 Test Condition 1: thermal impedance simulated values are based upon use of

2S2P JEDEC PCB. See the Ordering Guide.

2 θJA is the junction to ambient (or die to ambient) thermal resistance measured

in a one cubic foot sealed enclosure.

3 θJB is the junction-to-board thermal resistance.

4 θJCT is the junction-to-case top (or die to package) thermal resistance.

5 θJCB is the junction-to-case bottom thermal resistance.

6 ѰJT refers to the junction to top thermal characterization number.

7 ѰJB refers to the junction to board thermal characterization number.

ELECTROSTATIC DISCHARGE (ESD) RATING

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD-protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged-device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for ADL5961

Table 5. ADL5961, 26-Lead LGA

ESD Model

Withstand Threshold (V)

Class

HBM

2000

FICDM

500

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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