KSZ9567R datasheet(223/233 Pages) MICROCHIP

223 / 233 page

 2022 Microchip Technology Inc. and its subsidiaries

DS00002329E-page 223

KSZ9567R

FIGURE 8-2:

PACKAGE (DIMENSIONS)

Microchip Technology Drawing C04-418B Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Footprint

Exposed Pad Width

Molded Package Thickness

Pitch

Standoff

Units

Dimension Limits

(L1)

0.40 BSC

9.85

0.13

0.05

0.18

1.00 REF

10.00

16.00 BSC

MILLIMETERS

MIN

NOM

128

10.15

0.23

1.20

0.15

MAX

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

128-Lead Thin Quad Flatpack (6XX) - 14x14x1.0 mm Body [TQFP]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

With 10x10 mm Exposed Pad

Overall Length

Exposed Pad Length

9.85

16.00 BSC

10.00

10.15

DETAIL B

X= A OR B

Terminal Length

0.45

0.60

0.75

Molded Package Width

14.00 BSC

Molded Package Length

14.00 BSC

0.95

1.00

1.05

0°

7°

Footprint Angle

Terminal Thickness

0.09

0.20

KSZ9567R 数据表(PDF) 223 Page - Microchip Technology

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