L6740L datasheet(12/44 Pages) STMICROELECTRONICS

12 / 44 page

Pins description and connection diagrams

L6740L

12/44

2.2

Thermal data

Table 3.

Thermal data

NB_ENDRV

External driver enable.

Open Drain output used to control NB Section external driver status:

pulled-low to manage HiZ conditions or pulled-high to enable the driver.

Pull up to 3.3V (typ) or lower.

When in PVI Mode, NB Section is always kept in HiZ.

ENDRV

External Driver enable.

Open Drain output used to control CORE Section external driver status:

pulled-low to manage HiZ conditions or pulled-high to enable the driver.

Pull up to 3.3V (typ) or lower.

NB_PWM

PWM output.

Connect to external driver PWM input. The device is able to manage

HiZ status by setting the pin floating. When in PVI Mode, NB Section is

kept in HiZ. See Section 5.4.4 for details about HiZ management.

45 to

PWM1 to

PWM4

PWM outputs.

Connect to external drivers PWM inputs. The device is able to manage

HiZ status by setting the pins floating.

By shorting to SGND PWM4 or PWM3 and PWM4, it is possible to pro-

gram the CORE section to work at 3 or 2 phase respectively.

See Section 5.4.4 for details about HiZ management.

Thermal pad

Thermal pad connects the Silicon substrate and makes good thermal

contact with the PCB. Connect to the PGND plane.

Table 2.

Pin description (continued)

Pin#

Name

Function

Symbol

Parameter

Value

Unit

RthJA

Thermal resistance junction to ambient

(Device soldered on 2s2p PC Board)

°C/W

RthJC

Thermal resistance junction to case

°C/W

TMAX

Maximum junction temperature

150

°C

TSTG

Storage temperature range

-40 to 150

°C

Junction temperature range

0 to 125

°C

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