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STM32L4P5CE 数据表(PDF) 292 Page - STMicroelectronics |
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STM32L4P5CE 数据表(HTML) 292 Page - STMicroelectronics |
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292 / 311 page  Package information STM32L4P5xx 292/311 DS12903 Rev 2 Device marking for WLCSP100 The following figure gives an example of topside marking orientation versus pin 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 90. WLCSP100 marking (package top view) 1. Parts marked as ES or E or accompanied by an engineering sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 129. WLCSP100 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 mm Dpad 0.225 mm Dsm 0.290 mm Stencil thickness 0.1 mm MSv61150V1 Date code 32L4P5G6 Yww A Product identification (1) Ball 1 indentifier |
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