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STM32L4P5CE 数据表(PDF) 295 Page - STMicroelectronics |
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STM32L4P5CE 数据表(HTML) 295 Page - STMicroelectronics |
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295 / 311 page  DS12903 Rev 2 295/311 STM32L4P5xx Package information 307 Figure 93. UFBGA132 recommended footprint e - 0.500 - - 0.0197 - Z - 0.750 - - 0.0295 - ddd - 0.080 - - 0.0031 - eee - 0.150 - - 0.0059 - fff - 0.050 - - 0.0020 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 131. UFBGA132 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Ball diameter 0.280 mm Table 130. UFBGA132 mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max UFBGA132_A0G8_FP_V1 Dpad Dsm |
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