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STGF30H65DFB2 数据表(PDF) 1 Page - STMicroelectronics |
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STGF30H65DFB2 数据表(HTML) 1 Page - STMicroelectronics |
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1 / 15 page ![]() TO-220FP 1 2 3 C (2) G (1) E (3) Sc12850_no_tab Features • Maximum junction temperature : TJ = 175 °C • Low VCE(sat) = 1.65 V (typ.) @ IC = 30 A • Very fast and soft recovery co-packaged diode • Minimized tail current • Tight parameter distribution • Low thermal resistance • Positive VCE(sat) temperature coefficient Applications • Welding • Power factor correction • UPS • Solar inverters • Chargers Description The newest IGBT 650 V HB2 series represents an evolution of the advanced proprietary trench gate field-stop structure. The performance of the HB2 series is optimized in terms of conduction, thanks to a better VCE(sat) behavior at low current values, as well as in terms of reduced switching energy. A very fast soft recovery diode is co-packaged in antiparallel with the IGBT. The result is a product specifically designed to maximize efficiency for a wide range of fast applications. Product status link STGF30H65DFB2 Product summary Order code STGF30H65DFB2 Marking G30H65DFB2 Package TO-220FP Packing Tube Trench gate field-stop, 650 V, 30 A, high-speed HB2 series IGBT in a TO ‑220FP package STGF30H65DFB2 Datasheet DS13256 - Rev 2 - May 2020 For further information contact your local STMicroelectronics sales office. www.st.com |
类似零件编号 - STGF30H65DFB2 |
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类似说明 - STGF30H65DFB2 |
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