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2017 - 2025 Microchip Technology Inc. and its subsidiaries

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

A3

e

L

E

N

2.54 BSC

0.20 REF

0.80

1.15

0.80

0.00

0.90

1.20

0.85

0.02

3.20 BSC

MILLIMETERS

MIN

NOM

4

1.00

1.25

0.90

0.05

MAX

K

1.20 REF

Terminal Spacing

Overall Length

D

5.00 BSC

Terminal 1 Tab

L2

0.20 REF

Terminal 1 Tab

b1

0.10 REF

Terminal 1 Chamfer

CH

0.25 REF

Terminal Pull Back

L1

0.10 REF

Microchip Technology Drawing C04-1008-H6A Rev C Sheet 2 of 2

4-Lead Very Thin Plastic Dual Flat, No Lead Package (H6A) - 5x3.2 mm Body [VDFN]