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2017 - 2025 Microchip Technology Inc. and its subsidiaries

DS20005529D-page 19

DSC1001/3/4

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Contact Pitch

MILLIMETERS

0.30

MIN

E

MAX

Contact Pad Length (X4)

Y1

1.10

NOM

2

1

C0

0

.

2

g

n

i

c

a

p

S

d

a

P

t

c

a

t

n

o

C

Contact Pad to Contact Pad (X2)

G2

1.14

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Center Pad (X2)

G1

1.00

X1

G1

Y1

C

E

3

4

SILK SCREEN

0

4

.

1

1

X

)

4

X

(

h

t

d

i

W

d

a

P

t

c

a

t

n

o

C

Microchip Technology Drawing C04-3008 Rev C

4-Lead Very Thin Plastic Dual Flat, No Lead Package (H6A) - 5x3.2 mm Body [VDFN]

Terminal 1 Contact Pad Chamfer

CH

EDGE OF PACKAGE

G2

E

2

2.54