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DS20005529D-page 14

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2017 - 2025 Microchip Technology Inc. and its subsidiaries

0.10 C

0.10 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

12

4

0.10 C

0.08 C

2X

4X

A1

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

4-Lead Very Thin Dual Flatpack, No Lead Package (JZA) - 7x5x0.9 mm Body [VDFN]

With 2.2x3.5 mm Exposed Pad

© 2024 Microchip Technology Inc.

Sheet 1 of 2

Microchip Technology Drawing C04-1025-JZA Rev B

NOTE 1

D

E

B

A

(DATUM A)

(DATUM B)

D2

E2

0.10

C A B

0.10

C A B

L

4X b

2.60 Ref

0.10

C A B

0.05

C

1.00 Ref

C0.25

1.50 Ref

12

4

A

C

SEATING

PLANE

(A3)

e