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2017 - 2025 Microchip Technology Inc. and its subsidiaries

DS20005529D-page 15

DSC1001/3/4

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2024 Microchip Technology Inc.

4-Lead Very Thin Dual Flatpack, No Lead Package (JZA) - 7x5x0.9 mm Body [VDFN]

With 2.2x3.5 mm Exposed Pad

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the pin 1 area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

5.08 Ref

0.203 Ref

3.40

1.10

1.35

0.80

0.00

1.40

1.20

3.50

0.85

-

5.00

MILLIMETERS

MIN

NOM

004

3.60

1.30

1.45

0.90

0.05

MAX

Overall Length

Exposed Pad Length

D

D2

2.10

7.00

2.20

2.30

Sheet 2 of 2

Microchip Technology Drawing C04-1025-JZA Rev B

4.90

5.10

6.90

7.10