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DS20005529D-page 16

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2017 - 2025 Microchip Technology Inc. and its subsidiaries

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Y2

X2

3.60

2.30

MILLIMETERS

MIN

MAX

3.90

Contact Pad Length (Xnn)

Contact Pad Width (Xnn)

Y1

X1

1.30

1.50

NOM

SILK SCREEN

C1

Contact Pad Spacing

5.08

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Center Pad (Xnn)

G1

0.69

Microchip Technology Drawing C04-3025-JZA Rev B

X2

Y2

X1

Y1

C1

C2

ØV

EV

EV

4-Lead Very Thin Dual Flatpack, No Lead Package [JZA] - 7x5x0.9 mm Body [VDFN]

With 2.2x3.5 mm Exposed Pad

1

2

3

4

G1

© 2024 Microchip Technology Inc.