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DSC1001 数据表(PDF) 21 Page - Microchip Technology |
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DSC1001 数据表(HTML) 21 Page - Microchip Technology |
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21 / 31 page ![]() 2017 - 2025 Microchip Technology Inc. and its subsidiaries DS20005529D-page 21 DSC1001/3/4 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2024 Microchip Technology Inc. 4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN] REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. 2. 3. Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Sheet 2 of 2 Microchip Technology Drawing C04-1006-H4A Rev C Number of Terminals Overall Height Overall Width Terminal Length Terminal Width Pitch Standoff Units Dimension Limits A1 A b e L E N 2.10 BSC 0.85 0.70 0.80 0.00 0.80 0.90 0.85 0.02 2.50 BSC MILLIMETERS MIN NOM 4 0.95 0.90 0.90 0.05 MAX Overall Length D 3.20 BSC Terminal 1 Index Chamfer CH 0.25 REF |
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