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M39832 数据表(PDF) 2 Page - STMicroelectronics |
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M39832 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 36 page ![]() Warning: NC = Not Connected. VSS DQ8 DQ1 A6 A1 EF A3 A2 EE DQ14 A9 A10 DQ12 W A15 DQ10 DQ6 VCC DQ9 DQ2 DQ3 DQ11 DQ4 RP NC A18 A7 FRB NC A17 AI00845 M39832 12 1 13 24 25 36 37 48 A0 A8 DQ13 ERB DQ5 A5 DQ0 A4 G A16 BYTE VSS DQ15A–1 DQ7 A13 A14 A12 A11 Figure 2. TSOP Pin Connections A0-A18 Address Inputs DQ0-DQ7 Data Input/Outputs, Commands Input DQ8-DQ14 Data Input/Outputs DQ15A–1 Data Input/Outputs or Address Input EE EEPROM Array Enable EF Flash Array Enable G Output Enable W Write Enable RP Reset/Block Temporary Unprotect ERB EEPROM Ready/Busy Output FRB Flash Ready/Busy Output BYTE Flash Array Byte/Word Organization VCC Supply Voltage VSS Ground Table 1. Signal Names DESCRIPTION (cont’d) The M39832 Flash Memory array can be config- ured as 1Mb x8 or 512Kb x16 with the BYTE input pin. The M39832-T and M39832-B feature asymet- rically blocked architecture providing system mem- ory integration. Both M39832-B and M39832-T devices have a Flash array of 19 blocks, one Boot Block of 16 KBytes or 8 KWords, two Parameter Blocks of 8 KBytes or 4 KWords, one Main Block of 32 KBytes or 16 KWords and fifteen Main Blocks of 64 KBytes or 32 KWords. The M39832-T has the Boot Block at the top of the memory address space and the M39832-B locates the Boot Block starting at the bottom. The memory maps are showed in Figures 3A and 3B. Each block can be erased separately,any combination of blocks can be speci- fied for multi-block erase or the entire chip may be erased. The Erase operations are managed auto- matically. The block erase operation can be sus- pended in order to read from or program to any block not being ersased, and then resumed. Block protection provides additional data security. Each block can be separately protected or unprotected against Program or Erase on programming equip- ment. All previously protected blocks can be tem- porarily unprotected in the application. The Flash memory array is functionally compatible with the M29W800 Single Voltage Flash Memory device. During a Program or Erase cycle in the Flash array or during a Write in the EEPROM array, status bits available on certain DQn pins provide information on the M39832 internal logic. PIN DESCRIPTION Byte/Word Organization Select (BYTE). The BYTE input selects the output configuration for the Flash array: Byte-wide (x8) mode or Word-wide (x16) mode. The EEPROM array and the 64 Bytes OTP Row are always accessed Byte-wide (x8). When BYTE is High, the Word-wide mode is se- lected for the Flash array (x16) and the data are read and programmed on DQ0-DQ15. The Flash array is accessed with A0-A18 Adrress lines. In this mode, data in the EEPROM array (x8) are read and programmed on DQ0-DQ7 and the array is ac- cessed with A0-A14. The 64 bytes OTP are read and programmed on DQ0-DQ7 and are accessed with A0-A5 and A6 = 0. When BYTE is Low, the Byte-wide mode is selected for the Flash array (x8) and the data are read and 2/36 M39832 |
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