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ST72411R 数据表(PDF) 66 Page - STMicroelectronics |
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ST72411R 数据表(HTML) 66 Page - STMicroelectronics |
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66 / 71 page ![]() ST72411R 66/71 PACKAGE MECHANICAL DATA (Cont’d) Figure 44. Recommended Reflow Oven Profile (MID JEDEC) 9.2 ADAPTOR / SOCKET PROPOSAL To solder the (E)TQFP64 package or to plug the emulator probe, the application board should pro- vide the footprint described in Figure 45. This foot- print allows the following connexion configura- tions: s Direct (E)TQFP64 soldering s YAMAICHI IC149-064-008-S5* socket soldering to plug either the emulator probe or an adaptator board with an (E)TQFP64 clamshell socket delivered with the emulator. * Not compatible with (E)TQFP64 package. Figure 45. (E)TQFP64 device and emulation probe compatible footprint 250 200 150 100 50 0 100 200 300 400 Time [sec] Temp. [ °C] ramp up 2 °C/sec for 50sec 90 se c at 125 °C 150 sec above 183 °C ramp do wn natural 2 °C/sec max Tmax=220 +/-5 °C for 25 sec DETAIL e B * SK: Plastic socket overall dimensions. Dim mm inches Min Typ Max Min Typ Max B 0.35 0.45 0.50 0.014 0.018 0.020 E 20.80 0.819 E1 14.00 0.551 E3 11.90 12.00 12.10 0.468 0.472 0.476 e 0.75 0.80 0.85 0.029 0.031 0.033 SK* 26 1.023 Number of Pins N 64 (4x16) E E1 E3 62 &. ( 7 SK |
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