ST72411R datasheet(56/71 Pages) STMICROELECTRONICS

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ST72411R

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7 ELECTRICAL CHARACTERISTICS

7.1 ABSOLUTE MAXIMUM RATINGS

This product contains devices for protecting the in-

puts against damage due to high static voltages,

however it is advisable to take normal precautions

to avoid appying any voltage higher than the spec-

ified maximum rated voltages.

For proper operation it is recommended that VI

and VO be higher than VSS and lower than VDD.

Reliability is enhanced if unused inputs are con-

nected to an appropriate logic voltage level (VDD

or VSS).

Power Considerations. The average chip-junc-

tion temperature, TJ, in Celsius can be obtained

from:

TJ =

TA + PD x RthJA

Where:

TA =

Ambient Temperature.

RthJA =Package thermal resistance

(junction-to ambient).

PD =PINT +PPORT.

PINT =IDD xVDD (chip internal power).

PPORT =Port power dissipation

determined by the user)

Note: Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at these conditions is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

General Warning: Direct connection to VDD or VSS of the RESET and I/O pins could damage the device in case of pro-

gram counter corruption (due to unwanted change of the I/O configuration). To guarantee safe conditions, this connection

has to be done through a typical 10K

Ω pull-up or pull-down resistor.

Thermal Characteristics

Symbol

Ratings

Value

Unit

VDD -VSS

Supply voltage

7.0

VIN

Input voltage

SS - 0.3 to VDD + 0.3

VOUT

Output voltage

VSS - 0.3 to VDD + 0.3

ESD

ESD susceptibility

3500

IVDD_i

Total current into VDD_i (source)

150

IVSS_i

Total current out of VSS_i (sink)

150

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance

TQFP64

EQFP64

N/A

°C/W

TJmax

Max. junction temperature

150

°C

TSTG

Storage temperature range

-65 to +150

°C

Power dissipation

500

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