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STLC1511 数据表(PDF) 27 Page - STMicroelectronics |
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STLC1511 数据表(HTML) 27 Page - STMicroelectronics |
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27 / 31 page ![]() 27/31 STLC1511 4.0 PACKAGE INFORMATION, SUPPLY RATINGS, AND OPERATING ENVIRONMENT 4.1 The thermal impedance The thermal impedance of the package is about 64 °C/W for the following conditions° COMMENT ON RELIABILITY: The maximum continuous junction temperature for this part while meeting 20 year reliability is 125°C. 4.2 Environmental Conditions 4.3 Power Supply Input Limits Table 21. defines the maximum and minimum power supply requirements to meet specifications as outlined in section 3.2 and 3.3. Table 18. Board Assumptions: PC Board 6 layer, 1oz copper Ambient Temperature 850C Air Flow natural convection Power Dissipation 300mW Table 19. Board Assumptions: PC Board 6 layer, 1oz copper Ambient Temperature 850C Air Flow natural convection Power Dissipation 300mW Table 20. Environment conditions Ta Long-Term (Continuous) -40 to +80 0C Ta Short-Term 1 <1>Short-term is defined as no greater than 96 consecutive hours and 15 days per year. -40 to +85 0C Table 21. Power Supply Limits Parameter Limits Unit Conditions min typ max1 Positive Supply Voltage 4.75 5 5.25 Volts |
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