M24M01-R_08 datasheet(27/36 Pages) STMICROELECTRONICS

27 / 36 page

M24M01-R, M24M01-W, M24M01-HR

Package mechanical data

27/36

Package mechanical data

In order to meet environmental requirements, ST offers the M24M01-R, M24M01-HR and

M24M01-W in ECOPACK® packages. These packages have a lead-free second level

interconnect. The category of second level interconnect is marked on the package and on

the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings

related to soldering conditions are also marked on the inner box label. ECOPACK is an ST

trademark. ECOPACK specifications are available at www.st.com.

Figure 13.

SO8N – 8-lead plastic small outline, 150 mils body width, package outline

Drawing is not to scale.

Table 15.

SO8N – 8-lead plastic small outline, 150 mils body width, package data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

1.75

0.0689

0.1

0.25

0.0039

0.0098

1.25

0.0492

0.28

0.48

0.011

0.0189

0.17

0.23

0.0067

0.0091

ccc

0.1

0.0039

4.9

4.8

0.1929

0.189

0.1969

5.8

6.2

0.2362

0.2283

0.2441

3.9

3.8

0.1535

0.1496

0.1575

1.27

0.05

0.25

0.5

0.0098

0.0197

0°8°

0.4

1.27

0.0157

0.05

1.04

0.0409

SO-A

ccc

h x 45˚

0.25 mm

GAUGE PLANE

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