M24M01-R die description

M24M01-R, M24M01-W, M24M01-HR

30/36

Table 17.

1.

Pad locations are measured relative to the die center (where X and Y are the horizontal and vertical axis,

respectively, measured in µm). Refer to Figure 15.

Signal

X (µm)

Y (µm)

Pads

784.02

1683

8

WC

922

1383.1

7

SCL

922.78

–1171.22

6

SDA

922.78

–1450.14

5

–920.06

–1548.98

4

E2

–920.06

–1358.7

3

E1

–922.8

1270.7

2

E0

–922.8

1563.02

1