M24M01-R, M24M01-W, M24M01-HR

M24M01-R die description

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M24M01-R die description

Caution:

As EEPROM cells loose their charge (and so their binary value) when exposed to ultra violet

(UV) light, EEPROM dice delivered in wafer form by STMicroelectronics must never be

exposed to UV light.

Product

M24M01-A

●

Wafer size

203 mm (8 inches)

●

Die identification

M24M01, processed in the Rousset fab

Die Layout

●

Die size (X × Y)

2085 × 3605 µm (including scribe line)

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Scribe line

80.0 × 80.0 µm

●

Pad opening

90 × 90 µm

●

DI

Die identification (at the position shown in Figure 15)

●

Pads

Pad contacts (at the positions shown in Figure 15 and

Table 17)

Figure 15.

M24M01-R die plot

1.

Refer to Table 17: Pad coordinates for the pad locations.

Die identification: M24M01

VCC

WC

SCL

SDA

E1

E2

E0

Y

X

ai15446