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CS2000-CP 数据表(PDF) 15 Page - Cirrus Logic |
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CS2000-CP 数据表(HTML) 15 Page - Cirrus Logic |
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15 / 36 page ![]() CS2000-CP DS761F1 15 5.1.2 Crystal Connections (XTI and XTO) An external crystal may be used to generate RefClk. To accomplish this, a 20 pF fundamental mode par- allel resonant crystal must be connected between the XTI and XTO pins as shown in Figure 12. As shown, nothing other than the crystal and its load capacitors should be connected to XTI and XTO. Please refer to the “AC Electrical Characteristics” on page 8 for the allowed crystal frequency range. 5.1.3 External Reference Clock (REF_CLK) For operation with an externally generated REF_CLK signal, XTI/REF_CLK should be connected to the reference clock source and XTO should be left unconnected or pulled low through a 47 k Ω resistor to GND. 5.2 Frequency Reference Clock Input, CLK_IN The frequency reference clock input (CLK_IN) is used in Hybrid PLL Mode by the Digital PLL and Fractional- N Logic block to dynamically generate a fractional-N value for the Frequency Synthesizer (see “Hybrid An- alog-Digital PLL” on page 13). The Digital PLL first compares the CLK_IN frequency to the PLL output. The Fractional-N logic block then translates the desired ratio based off of CLK_IN to one based off of the internal timing reference clock (SysClk). This allows the low-jitter timing reference clock to be used as the clock which the Frequency Synthesizer multiplies while maintaining synchronicity with the frequency reference clock through the Digital PLL. The allowable frequency range for CLK_IN is found in the “AC Electrical Char- acteristics” on page 8. 5.2.1 CLK_IN Skipping Mode CLK_IN skipping mode allows the PLL to maintain lock even when the CLK_IN signal has missing pulses for up to 20 ms (tCS) at a time (see “AC Electrical Characteristics” on page 8 for specifications). CLK_IN skipping mode can only be used when the CLK_IN frequency is below 80 kHz and CLK_IN is reapplied within 20 ms of being removed. The ClkSkipEn bit enables this function. XTI XTO 40 pF 40 pF Figure 12. External Component Requirements for Crystal Circuit |
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