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CS2000-CP 数据表(PDF) 35 Page - Cirrus Logic |
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CS2000-CP 数据表(HTML) 35 Page - Cirrus Logic |
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35 / 36 page ![]() CS2000-CP DS761F1 35 10.PACKAGE DIMENSIONS Notes: 1. Reference document: JEDEC MO-187 2. D does not include mold flash or protrusions which is 0.15 mm max. per side. 3. E1 does not include inter-lead flash or protrusions which is 0.15 mm max per side. 4. Dimension b does not include a total allowable dambar protrusion of 0.08 mm max. 5. Exceptions to JEDEC dimension. THERMAL CHARACTERISTICS INCHES MILLIMETERS NOTE DIM MIN NOM MAX MIN NOM MAX A -- -- 0.0433 -- -- 1.10 A1 0 -- 0.0059 0 -- 0.15 A2 0.0295 -- 0.0374 0.75 -- 0.95 b 0.0059 -- 0.0118 0.15 -- 0.30 4, 5 c 0.0031 -- 0.0091 0.08 -- 0.23 D -- 0.1181 BSC -- -- 3.00 BSC -- 2 E -- 0.1929 BSC -- -- 4.90 BSC -- E1 -- 0.1181 BSC -- -- 3.00 BSC -- 3 e -- 0.0197 BSC -- -- 0.50 BSC -- L 0.0157 0.0236 0.0315 0.40 0.60 0.80 L1 -- 0.0374 REF -- -- 0.95 REF -- Parameter Symbol Min Typ Max Units Junction to Ambient Thermal Impedance JEDEC 2-Layer JEDEC 4-Layer θJA θJA - - 170 100 - - °C/W °C/W 10L MSOP (3 mm BODY) PACKAGE DRAWING (Note 1) E N 1 23 e b A1 A2 A D SEATING PLANE E11 L SIDE VIEW END VIEW TOP VIEW ∝ L1 c |
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