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PIC12F1822-I/MF 数据表(PDF) 346 Page - Microchip Technology |
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PIC12F1822-I/MF 数据表(HTML) 346 Page - Microchip Technology |
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346 / 398 page ![]() PIC12F/LF1822/16F/LF1823 DS41413A-page 346 Preliminary 2010 Microchip Technology Inc. 29.6 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C Param No. Sym. Characteristic Typ. Units Conditions TH01 JA Thermal Resistance Junction to Ambient TBD C/W 8-pin PDIP package TBD C/W 8-pin SOIC package TBD C/W 8-pin DFN 3X3mm package TBD C/W 14-pin PDIP package TBD C/W 14-pin SOIC package TBD C/W 14-pin TSSOP 4x4mm package TBD C/W 16-pin QFN 4X4mm package TH02 JC Thermal Resistance Junction to Case TBD C/W 8-pin PDIP package TBD C/W 8-pin SOIC package TBD C/W 8-pin DFN 3X3mm package TBD C/W 14-pin PDIP package TBD C/W 14-pin SOIC package TBD C/W 14-pin TSSOP 4x4mm package TBD C/W 16-pin QFN 4X4mm package TH03 TJMAX Maximum Junction Temperature 150 C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/ JA(2) Legend: TBD = To Be Determined Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature. 3: TJ = Junction Temperature. |
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