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HT68FU50 数据表(PDF) 241 Page - Holtek Semiconductor Inc |
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HT68FU50 数据表(HTML) 241 Page - Holtek Semiconductor Inc |
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241 / 244 page  SSOP 16S Symbol Description Dimensions in mm W Carrier Tape Width 12.0 +0.3/-0.1 P Cavity Pitch 8.0 ±0.1 E Perforation Position 1.75 ±0.10 F Cavity to Perforation (Width Direction) 5.5 ±0.1 D Perforation Diameter 1.55 ±0.10 D1 Cavity Hole Diameter 1.50 +0.25/-0.00 P0 Perforation Pitch 4.0 ±0.1 P1 Cavity to Perforation (Length Direction) 2.0 ±0.1 A0 Cavity Length 6.4 ±0.1 B0 Cavity Width 5.2 ±0.1 K0 Cavity Depth 2.1 ±0.1 t Carrier Tape Thickness 0.30 ±0.05 C Cover Tape Width 9.3 ±0.1 SSOP 20S (150mil) Symbol Description Dimensions in mm W Carrier Tape Width 16.0 +0.3/-0.1 P Cavity Pitch 8.0 ±0.1 E Perforation Position 1.75 ±0.10 F Cavity to Perforation (Width Direction) 7.5 ±0.1 D Perforation Diameter 1.5 +0.1/-0.0 D1 Cavity Hole Diameter 1.50 +0.25/-0.00 P0 Perforation Pitch 4.0 ±0.1 P1 Cavity to Perforation (Length Direction) 2.0 ±0.1 A0 Cavity Length 6.5 ±0.1 B0 Cavity Width 9.0 ±0.1 K0 Cavity Depth 2.3 ±0.1 t Carrier Tape Thickness 0.30 ±0.05 C Cover Tape Width 13.3 ±0.1 HT68F20/HT68F30/HT68F40/HT68F50/HT68F60 HT68FU30/HT68FU40/HT68FU50/HT68FU60 Rev. 1.50 241 March 15, 2011 |
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