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ADP5040ACPZ-1-R7 数据表(PDF) 6 Page - Analog Devices |
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ADP5040ACPZ-1-R7 数据表(HTML) 6 Page - Analog Devices |
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6 / 40 page ![]() ADP5040 Data Sheet Rev. 0 | Page 6 of 40 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating AVIN to AGND −0.3 V to +6 V VIN1 to AVIN −0.3 V to +0.3 V PGND to AGDN −0.3 V to +0.3 V VIN2, VIN3, VOUTx, ENx, MODE, FBx, SW to AGND −0.3 V to (AVIN + 0.3 V) SW to PGND −0.3 V to (VIN1 + 0.3 V) Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 ESD Human Body Model 3000 V ESD Charged Device Model 1500 V ESD Machine Model 200 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 6. Thermal Resistance Package Type θJA θJC Unit 20-Lead, 0.5 mm pitch LFCSP 38 4.2 °C/W ESD CAUTION |
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