REV. 0

AD9433

–23–

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

Thermally Enhanced

52-Lead Power Thin Plastic Quad Flatpack (LQFP_ED)

(SQ-52)

0.026 (0.65)

0.015 (0.38)

0.013 (0.32)

0.009 (0.22)

0.472 (12.00) SQ

0.402 (10.20)

0.394 (10.00) SQ

0.386 (9.80)

TOP VIEW

(PINS DOWN)

40

52

1

14

13

26

27

39

0.307 (7.80)

0.063

(1.60)

MAX

VIEW A

SEATING

PLANE

0.030 (0.75)

0.024 (0.60)

0.018 (0.45)

0.006 (0.15)

0.002 (0.05)

VIEW A

0.004 (0.10)

COPLANARITY

0.057 (1.45)

0.055 (1.40)

0.053 (1.35)

40

52

1

14

13

26

27

39

EXPOSED

HEATSINK

(CENTERED)

0.093 (2.35)

0.087 (2.20)

0.081 (2.05)

(4 PLCS)

0.236 (6.00)

0.232 (5.90)

0.228 (5.80)

0.236 (6.00)

0.232 (5.90)

0.228 (5.80)

0.104 (2.65)

0.098 (2.50)

0.093 (2.35)

(4 PLCS)

BOTTOM VIEW

(PINS UP)

NOTES

1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS. INCH DIMENSIONS ARE ROUNDED OFF MILLIMETER

EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

2. ALTHOUGH NOT REQUIRED IN ALL APPLICATIONS,THE AD9433 HAS AN EXPOSED METALLIC PAD ON THE

PACKAGE BOTTOM WHICH IS INTENDED TO ENHANCE THE HEAT REMOVAL PATH. TO MAXIMIZE THE REMOVAL

OF HEAT, A LAND PATTERN WITH CLOSELY SPACED THERMAL VIAS TO THE GROUND PLANE(S) SHOULD

BE INCORPORATED ON THE PCB WITHIN THE FOOTPRINT OF THE PACKAGE CORRESPONDING TO THE

EXPOSED METAL PAD DIMENSIONS OF THE PACKAGE. THE SOLDERABLE LAND AREA SHOULD BE SOLDER

MASK DEFINED AND BE AT LEAST THE SAME SIZE AND SHAPE AS THE EXPOSED PAD AREA ON THE

PACKAGE. AT LEAST 0.25 MM CLEARANCE BETWEEN THE OUTER EDGES OF THE LAND PATTERN AND THE

INNER EDGES OF THE PAD PATTERN SHOULD BE MAINTAINED TO AVOID ANY SHORTS.