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LCMXO2-256ZE-3TG100C 数据表(PDF) 67 Page - Lattice Semiconductor |
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LCMXO2-256ZE-3TG100C 数据表(HTML) 67 Page - Lattice Semiconductor |
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67 / 106 page ![]() 3-28 DC and Switching Characteristics MachXO2 Family Data Sheet LPDDR 9 tDVADQ Input Data Valid After DQS Input MachXO2-1200/U and larger devices, right side only. — 0.349 — 0.381 — 0.396 UI tDVEDQ Input Data Hold After DQS Input 0.665 — 0.630 — 0.613 — UI tDQVBS Output Data Invalid Before DQS Output 0.25 — 0.25 — 0.25 — UI tDQVAS Output Data Invalid After DQS Output 0.25 — 0.25 — 0.25 — UI fDATA MEM LPDDR Serial Data Speed — 120 — 110 — 96 Mbps fSCLK SCLK Frequency — 60 — 55 — 48 MHz fLPDDR LPDDR Data Transfer Rate 0 120 0 110 0 96 Mbps DDR 9 tDVADQ Input Data Valid After DQS Input MachXO2-1200/U and larger devices, right side only. — 0.347 — 0.374 — 0.393 UI tDVEDQ Input Data Hold After DQS Input 0.665 — 0.637 — 0.616 — UI tDQVBS Output Data Invalid Before DQS Output 0.25 — 0.25 — 0.25 — UI tDQVAS Output Data Invalid After DQS Output 0.25 — 0.25 — 0.25 — UI fDATA MEM DDR Serial Data Speed — 140 — 116 — 98 Mbps fSCLK SCLK Frequency — 70 — 58 — 49 MHz fMEM_DDR MEM DDR Data Transfer Rate N/A 140 N/A 116 N/A 98 Mbps DDR2 9 tDVADQ Input Data Valid After DQS Input MachXO2-1200/U and larger devices, right side only. — 0.372 — 0.394 — 0.410 UI tDVEDQ Input Data Hold After DQS Input 0.690 — 0.658 — 0.618 — UI tDQVBS Output Data Invalid Before DQS Output 0.25 — 0.25 — 0.25 — UI tDQVAS Output Data Invalid After DQS Output 0.25 — 0.25 — 0.25 — UI fDATA MEM DDR Serial Data Speed — 140 — 116 — 98 Mbps fSCLK SCLK Frequency — 70 — 58 — 49 MHz fMEM_DDR2 MEM DDR2 Data Transfer Rate N/A 140 N/A 116 N/A 98 Mbps 1. Exact performance may vary with device and design implementation. Commercial timing numbers are shown at 85°C and 1.14V. Other operating conditions, including industrial, can be extracted from the Diamond software. 2. General I/O timing numbers based on LVCMOS 2.5, 8mA, 0pf load. 3. Generic DDR timing numbers based on LVDS I/O (for input, output, and clock ports). 4. DDR timing numbers based on SSTL25. DDR2 timing numbers based on SSTL18. LPDDR timing numbers based in LVCMOS18. 5. 7:1 LVDS (GDDR71) uses the LVDS I/O standard (for input, output, and clock ports). 6. For Generic DDRX1 mode tSU = tHO = (tDVE - tDVA - 0.03ns)/2. 7. The tSU_DEL and tH_DEL values use the SCLK_ZERHOLD default step size. Each step is 167ps (-3), 182ps (-2), 195ps (-1). 8. This number for general purpose usage. Duty cycle tolerance is +/-10%. 9. Duty cycle is +/- 5% for system usage. 10. The above timing numbers are generated using the Diamond design tool. Exact performance may vary with the device selected. Parameter Description Device -3 -2 -1 Units Min. Max. Min. Max. Min. Max. |
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