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STM8AF6166 数据表(PDF) 88 Page - STMicroelectronics |
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STM8AF6166 数据表(HTML) 88 Page - STMicroelectronics |
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88 / 89 page ![]() Revision history STM8AF61xx, STM8AF62xx 88/89 Doc ID 14952 Rev 6 18-Jul-2012 6 (continued) Section 10.3.7: Reset pin characteristics: updated text below Figure 35: Typical NRST pull-up current Ipu vs VDD. Figure 36: Recommended reset pin protection: updated unit of capacitor. Table 40: SPI characteristics: updated SCK high and low time conditions and values. Figure 39: SPI timing diagram - master mode: replaced ‘SCK input’ signals with ‘SCK output’ signals. Updated Table 49: VFQFPN 32-lead very thin fine pitch quad flat no- lead package mechanical data, Table 50: LQFP 48-pin low profile quad flat package mechanical data, and Table 51: LQFP 32-pin low profile quad flat package mechanical data. Replaced Figure 43: LQFP 48-pin low profile quad flat package (7 x 7) and Figure 45: LQFP 32-pin low profile quad flat package (7 x 7). Added Figure 44: LQFP 48-pin recommended footprint and Figure 46: LQFP 32-pin recommended footprint. Figure 47: Ordering information scheme(1): added footnote 1, added “xxx” and footnote 2, updated example and device family; added FASTROM. Section 13.2.2: C and assembly toolchains: added www.iar.com Table 52. Document revision history (continued) Date Revision Changes |
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