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C2.5X6.3MM-RAD 数据表(PDF) 32 Page - Silicon Laboratories |
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C2.5X6.3MM-RAD 数据表(HTML) 32 Page - Silicon Laboratories |
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32 / 38 page ![]() Si3226/7 Si3208/9 32 Preliminary Rev. 0.33 35 NC No Connect. 36 AGND I Analog Ground. 37 IC Internal connection; leave to float. 38 IC Internal connection; leave to float. 39 VBAT_1 I Operating Battery Voltage Channel 1 Input. 40 IC Internal connection; leave to float. epad Exposed Die Attach Paddle. For adequate thermal management, the exposed die paddle should be soldered to a printed circuit board pad that is connected to an electrically-isolated low-impedance inner layer and/or back- side thermal plane(s) using multiple thermal vias. Do not connect this pad to ground. Table 18. Si3208/9 Pin Descriptions (Continued) QFN Pin # Symbol I/O Description |
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