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C2.5X6.3MM-RAD 数据表(PDF) 35 Page - Silicon Laboratories |
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C2.5X6.3MM-RAD 数据表(HTML) 35 Page - Silicon Laboratories |
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35 / 38 page ![]() Si3226/7 Si3208/9 Preliminary Rev. 0.33 35 Table 19. 64-Pin TQFP Package Dimensions Dimension Min Nom Max A— — 1.20 A1 0.05 — 0.15 A2 0.95 1.00 1.05 b 0.17 0.22 0.27 c 0.09 — 0.20 D 12.00 BSC. D1 10.00 BSC. e 0.50 BSC. E 12.00 BSC. E1 10.00 BSC. L 0.45 0.60 0.75 aaa — — 0.20 bbb — — 0.20 ccc — — 0.08 ddd — — 0.08 Q0 ° 3.5 ° 7 ° Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. This package outline conforms to JEDEC MS-026, variant ACD. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for small body components. |
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