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AS0260CSSC28SUD20 数据表(PDF) 73 Page - ON Semiconductor |
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AS0260CSSC28SUD20 数据表(HTML) 73 Page - ON Semiconductor |
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73 / 83 page  AS0260 DS Rev. G Pub. 5/15 EN 73 ©Semiconductor Components Industries, LLC, 2015. AS0260: 1/6-Inch 1080P High-Definition (HD) System-On-A-Chip (SOC) Digi- tal Image Sensor CSP Package Details AS0260 sensor is also available in chip scale package (CSP) and this section provides the relevant CSP package details necessary for the optical design of camera system. Table 20: Package Dimension Parameter Symbol Millimeters Inches Nominal Min Max Nominal Min Max Package Body Dimension X A 6.005 5.97955 6.02955 0.23640 0.23542 0.23738 Package Body Dimension Y B 4.158 4.13255 4.18255 0.16368 0.16270 0.16467 Package Height C 0.710 0.655 0.765 0.02795 0.02579 0.03012 Cavity wall height C4 0.0410 0.0370 0.0450 0.00161 0.00146 0.00177 Cavity wall + epoxy thickness glass to the wafer bonding top point) C5 0.0435 0.0385 0.0485 0.00171 0.00152 0.00191 Glass Thickness C3 0.400 0.390 0.410 0.01575 0.01535 0.01614 Package Body Thickness C2 0.570 0.535 0.605 0.02244 0.02106 0.02382 Ball Height C1 0.140 0.110 0.170 0.00551 0.00433 0.00669 Ball Diameter D 0.280 0.250 0.310 0.01102 0.00984 0.01220 Total Ball Count 54 Ball Count X axis N1 9 Ball Count Y axis N2 6 UBM U 0.310 0.300 0.320 0.0122 0.01181 0.01260 Pins Pitch X axis J1 0.620 0.610 0.630 0.02441 0.02402 0.02480 Pins Pitch Y axis J2 0.620 0.610 0.630 0.02441 0.02402 0.02480 BGA ball center to package center offset in X-direction X 0 -0.025 0.025 0 -0.00098 0.00098 BGA ball center to package center offset in Y-direction Y 0 -0.025 0.025 0 -0.00098 0.00098 BGA ball center to chip center offset in X-direction X1 0.000 -0.014 0.014 0.000 -0.001 0.001 BGA ball center to chip center offset in Y-direction Y1 0.000 -0.014 0.014 0.000 -0.001 0.001 Edge to Ball Center Distance along X S1 0.522 0.492 0.552 0.02056 0.01938 0.02174 Edge to Ball Center Distance along Y S2 0.529 0.499 0.559 0.02082 0.01964 0.02200 |
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